PIXEL PACKAGING & COATING
What To Know About LED Pixel Packaging and Coating Options
On a fundamental level, video displays are made up of pixels, sometimes millions of them, and pixels are made up of diodes. In the early days of LED video technology, pixels were contained clearly visible diodes (DIP or Discrete-in-Package), but most displays built in recent years employ more advanced pixel packaging methods.
dvLEDs can also be treated with coating options that can improve the surface of the screen so that all those neatly packaged pixels have an extra layer of protection.
Here’s a helpful guide to some of the more common pixel packaging and coating options.
--- SMD ---
SMD (Surface-Mount Device) technology packages red, green, and blue LED dies into individual surface-mount devices that are mounted directly to the display module. Trusted across millions of square feet of LED installations worldwide, SMD offers proven reliability, excellent color performance, and broad availability across a wide range of pixel pitches. It is the industry standard for applications ranging from corporate environments and retail spaces to large-scale outdoor displays.
--- GOB ---
GOB (Glue on Board) technology applies a transparent protective resin over completed SMD modules, creating a sealed barrier around the LED packages. This protective layer helps improve resistance to impact, dust, moisture, and accidental contact while preserving brightness, color accuracy, and viewing performance. GOB is an effective solution for applications where displays may be exposed to public interaction or challenging operating conditions. Additionally, a much smoother surface can also improve touch-enabled applications for better interactive experiences.
--- COB ---
With COB (Chip on Board), tiny red, green, and blue diodes are soldered directly to the circuit board before being encapsulated beneath a protective epoxy layer. COB can achieve incredibly small pixel pitches while maintaining strong brightness and color performance, making it well-suited for high-resolution environments with close viewing distances. It is sometimes thought to be a micro-LED class of technology.
--- MIP ---
MIP (MicroLED-in-Package) technology packages individual RGB pixels into extremely compact modules before assembly onto the display substrate, allowing for exceptionally fine pixel pitches (down to 0.4 mm with even tighter pitches planned) and highly refined image performance. This approach combines many of the advantages associated with COB with the manufacturing flexibility and serviceability of packaged LED systems. MIP is helping bridge the gap between traditional LED displays and the next generation of ultra-high-resolution visual experiences.